The **ATS-03F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Fine Pitch (Straight) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 26.55 °C/W (Unducted @ 100 LFM) | | **Hardware included** | ATS-HK117-R0 (Spring/Pin assembly) | --- ### 2. Key Features and Design The "electronic" functionality of this part is passive, focusing on heat dissipation to prevent thermal throttling or component failure. * **pushPIN™ Attachment:** Unlike adhesive tapes, this uses a precise spring-loaded mechanism. This ensures consistent pressure (TIM - Thermal Interface Material compression) across the chip surface for optimal heat transfer. * **High-Performance Fin Design:** The "Fine Pitch" geometry is optimized for high-density electronic assemblies where airflow might be restricted. * **Pre-drilled Mounting:** The heat sink comes with pre-drilled holes specifically spaced (24.00mm x 24.00mm) to match standard PCB layouts. * **Thermal Interface Material (TIM):** It typically comes with **T412** thermal tape or pre-applied phase-change material to bridge the microscopic air gaps between the component and the aluminum. --- ### 3. Part Number Breakdown (Nomenclature) To understand what each segment of **ATS-03F-49-C3-R0** means: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **03** | Series / Attachment Style | | **F** | Fin Pitch (F = Fine) | | **49** | Specific Model Reference | | **C3** | Material/Thermal Performance Grade | | **R0** | RoHS Compliance / Revision Level | --- ### 4. Implementation Example When integrating this into a PCB design, the footprint must account for the pin holes: ```markdown PCB Layout Requirements: - Component Size: 30mm x 30mm - Hole-to-Hole Distance: 24.00mm - Suggested Hole Diameter: 3.15mm (for pushPIN clips) - Clearance: Ensure 10mm vertical clearance for the fin height. ```