ATS-03F-50-C3-R0
AI

The **ATS-03F-50-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" family, designed for securing to Printed Circuit Boards (PCBs) to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Type** | Fine-Pitch (Cross-Cut) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Thermal Resistance** | 19.03 °C/W (Unducted @ 100 LFM) |
| **Pitch** | 1.45mm |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Physical Design Features
* **Heat Sink Material:** Made of aluminum for high thermal conductivity while remaining lightweight. The blue anodized finish provides surface protection and slightly improves radiation heat transfer.
* **The "pushPIN" System:** Instead of messy adhesives or simple clips, it uses a precise spring-loaded mechanism. This ensures constant, uniform pressure on the electronic component, which optimizes the thermal interface material (TIM) performance.
* **Fin Geometry:** The "Cross-Cut" pattern allows for airflow from multiple directions, making it efficient in cramped electronic enclosures where air direction might be turbulent.
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### 3. Thermal Performance Indicators
The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM) within the device:
| Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) |
| :--- | :--- | :--- |
| 100 (0.5 m/s) | 2.39 °C/W | 19.03 °C/W |
| 300 (1.5 m/s) | 1.41 °C/W | 4.88 °C/W |
| 500 (2.5 m/s) | 1.15 °C/W | 3.23 °C/W |
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### 4. Part Number Breakdown
The part number **ATS-03F-50-C3-R0** can be decoded as follows:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **03:** Series number.
* **F:** Fin pitch/type.
* **50:** Specific size/height code.
* **C3:** Material/Finish code (Blue Anodized).
* **R0:** Revision/Packaging code.
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What are the mounting hole requirements for the pushPIN system on a PCB?
- ⤷ How do I choose between a cross-cut and a straight-fin heat sink for my application?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for use with this heat sink?