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  • ATS-03F-50-C3-R0

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    The **ATS-03F-50-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" family, designed for securing to Printed Circuit Boards (PCBs) to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch (Cross-Cut) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 19.03 °C/W (Unducted @ 100 LFM) | | **Pitch** | 1.45mm | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Physical Design Features * **Heat Sink Material:** Made of aluminum for high thermal conductivity while remaining lightweight. The blue anodized finish provides surface protection and slightly improves radiation heat transfer. * **The "pushPIN" System:** Instead of messy adhesives or simple clips, it uses a precise spring-loaded mechanism. This ensures constant, uniform pressure on the electronic component, which optimizes the thermal interface material (TIM) performance. * **Fin Geometry:** The "Cross-Cut" pattern allows for airflow from multiple directions, making it efficient in cramped electronic enclosures where air direction might be turbulent. --- ### 3. Thermal Performance Indicators The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM) within the device: | Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 2.39 °C/W | 19.03 °C/W | | 300 (1.5 m/s) | 1.41 °C/W | 4.88 °C/W | | 500 (2.5 m/s) | 1.15 °C/W | 3.23 °C/W | --- ### 4. Part Number Breakdown The part number **ATS-03F-50-C3-R0** can be decoded as follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **03:** Series number. * **F:** Fin pitch/type. * **50:** Specific size/height code. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole requirements for the pushPIN system on a PCB?
    • ⤷ How do I choose between a cross-cut and a straight-fin heat sink for my application?
    • ⤷ What type of Thermal Interface Material (TIM) is recommended for use with this heat sink?