The **ATS-03F-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance (Unducted)** | 10.97 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.11 °C/W @ 100 LFM | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **03**: Part of the pushPIN™ series. * **F**: Denotes the specific fin pitch (typically Fine pitch). * **52**: Size/Geometry identifier. * **C3**: Thermal Interface Material (TIM) and color code. In this case, it usually indicates a pre-applied **T412 Phase Change Material**. * **R0**: RoHS compliance status. --- ### 3. Key Features * **pushPIN™ Attachment**: It uses a flexible attachment system consisting of a brass or plastic push-pin and a compression spring. This ensures a secure, consistent pressure on the component, improving heat transfer. * **Fine Fin Pitch**: The straight-fin design is optimized for environments with airflow (forced convection), providing a high surface-area-to-volume ratio. * **Pre-applied TIM**: It comes with a high-performance thermal interface material, reducing assembly time and ensuring a reliable thermal bond between the chip and the aluminum base. --- ### 4. Application Use-Cases 1. **Embedded Systems**: Cooling processors in industrial or automotive computers. 2. **Telecommunications**: Heat dissipation for high-speed networking chips. 3. **Power Electronics**: Cooling MOSFETs or IGBTs in power supply units.