The **ATS-03F-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 6.36°C/W (Unducted @ 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 35mm | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### Key Component Details #### 1. Push-Pin Mounting System This model features a **push-pin and spring** assembly. * **Purpose:** It provides a secure mechanical attachment to the PCB. * **Benefits:** The spring-loaded mechanism ensures consistent pressure (clamping force) on the electronic component, which optimizes the heat transfer through the Thermal Interface Material (TIM). #### 2. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves surface emissivity for better radiant heat transfer. #### 3. Fin Profile (Straight Fin) The **Straight Fin** design is optimized for environments where there is a consistent, predictable airflow direction (forced convection). The spacing between the fins is engineered to balance the surface area for cooling against the pressure drop of the air passing through. #### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * This is a phase-change material or high-performance pad that fills the microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance at the contact point. --- ### Use Cases in Electronics * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Heat dissipation for industrial ARM or FPGA chips. * **Networking:** Cooling processors inside routers or switches.