The **ATS-03F-67-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications Below is a breakdown of the key physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance (Flowing)** | 1.30 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 20.30 °C/W | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Design Components ### A. Fin Profile (Straight Fin) The "67" in the part number indicates the specific fin pattern. This model uses a **straight-fin design**, which is ideal for systems with a steady, directional airflow. The low profile (10mm) makes it suitable for high-density electronic enclosures where vertical space is limited. ### B. PushPIN™ Attachment System Unlike adhesive tapes or simple clips, the pushPIN™ system uses a flexible mechanism: * **Compression Springs:** Ensure even pressure across the component surface for maximum heat transfer. * **Push Pins:** Available in different materials (Plastic or Brass) to secure the sink to the PCB through pre-drilled holes. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal impedance. --- ## 3. Part Number Decoder Understanding the "ATS-03F-67-C2-R0" nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **03:** Product Series * **F:** Attachment style (Push-pin) * **67:** Fin pattern/design code * **C2:** Material/Color code (Aluminum / Blue Anodized) * **R0:** Revision/Packaging status --- ## 4. Application Use Cases * **Telecommunications:** Cooling of high-speed networking processors. * **Embedded Systems:** Heat management for compact industrial computers. * **Power Electronics:** Dissipating heat from MOSFETs or power regulators.