The **ATS-03F-74-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling components directly to Printed Circuit Boards (PCBs). --- ### 1. Technical Specifications Below are the primary electronic and physical parameters for this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Type** | Cross-Cut | | **Thermal Resistance** | 8.90°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | --- ### 2. Physical Design Features #### A. Fin Pattern (Cross-Cut) Unlike traditional straight-fin heat sinks, the cross-cut design allows for **multi-directional airflow**. This is critical in modern electronic enclosures where airflow might not be perfectly linear, ensuring that heat is dissipated efficiently regardless of the orientation of the cooling fan. #### B. Thermal Interface Material (TIM) The "C3" in the part number indicates that this unit typically comes pre-applied with **T412 thermal tape**. This eliminates the need for manual application of thermal paste, ensuring a consistent and reliable thermal bond between the electronic chip (IC) and the heat sink. #### C. Mounting Mechanism It utilizes a **Push-Pin** system with a built-in spring. This provides: * **Constant Pressure:** Ensures the heat sink stays flush against the component. * **Vibration Resistance:** Secure enough for automotive or industrial applications. * **Tool-less Assembly:** Simplifies the manufacturing process on the assembly line. --- ### 3. Electronic Application Use-Cases This specific heat sink is typically used for cooling the following types of electronic components: 1. **Processors & SoCs:** Medium-sized CPUs or System-on-Chips used in networking gear. 2. **FPGAs:** Field Programmable Gate Arrays that generate significant heat during high-speed logic operations. 3. **Power Modules:** High-voltage regulators or MOSFET arrays that require localized cooling to prevent thermal throttling. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 8.90 | | 300 (1.5 m/s) | 3.40 | | 500 (2.5 m/s) | 2.30 |