The **ATS-03F-76-C3-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 25mm x 25mm x 10mm | | **Fin Type** | Fine Pitch | | **Fin Pattern** | Straight | | **Thermal Resistance** | 27.60°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Phase-change material) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by ATS: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **03:** Part of the specific pushPIN™ series. * **F:** Denotes a "Fine-Pitch" fin design for high-density airflow. * **76:** Indicates the specific product sequence/dimension profile. * **C3:** Refers to the thermal performance/resistance category. * **R0:** Indicates the revision status or specific packaging/material compliance (typically RoHS compliant). --- ### 3. Key Electronic Functions While the heat sink itself is passive (no electricity flows through it), it is critical for the electronic health of a system: 1. **Thermal Dissipation:** It increases the surface area of the heat-generating component (e.g., a power MOSFET or FPGA), allowing the surrounding air to carry heat away more efficiently. 2. **Thermal Interface Material (T412):** This part comes pre-applied with T412, which fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance compared to dry contact. 3. **Mechanical Attachment:** The `pushPIN™` mechanism uses a brass or plastic pin with a compressed spring. This ensures a consistent "clamping force" on the electronic chip, preventing the sink from shifting during vibration or thermal expansion. --- ### 4. Typical Applications * **Embedded Systems:** Cooling small form-factor processors. * **Telecommunications:** Signal processing units that generate localized high heat. * **Power Electronics:** Dissipating heat from voltage regulators or motor drivers.