The **ATS-03F-80-C3-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to their **maxiFLOW™** series of heat sinks, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Fin Style** | maxiFLOW (Flared Fin) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 3.51 °C/W @ 200 LFM | | **Thermal Interface Material** | T412 (Phase Change) | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Geometry Unlike standard straight-fin heat sinks, the maxiFLOW design features a **flared fin** structure. This increases the surface area for heat dissipation and improves airflow performance in systems with constrained air paths. #### B. pushPIN™ Attachment The part uses a specialized attachment system consisting of: - **Plastic/Brass Pins:** Pre-assembled for quick installation. - **Stainless Steel Springs:** Provide precise pressure (compression) to ensure optimal contact between the heat sink and the electronic component. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates it comes pre-applied with **T412 thermal tape**. This is a high-performance phase-change material that eliminates the need for manual application of thermal grease, ensuring a uniform thermal bond. --- ### 3. Part Number Breakdown The nomenclature for this part follows a specific logic used by ATS: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **03** | Product Family (maxiFLOW) | | **F** | Fin Pitch/Style | | **80** | Dimension/Height Code | | **C3** | Thermal Interface Material (T412) | | **R0** | RoHS Compliance / Revision Level | --- ### 4. Applications This part is typically found in: - **Telecommunications:** Cooling networking chips and routers. - **Embedded Systems:** High-power microcontrollers or industrial PCs. - **Power Electronics:** Managing heat for voltage regulators or small power modules.