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  • ATS-03F-82-C3-R0

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    The **ATS-03F-82-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions, Inc.** It belongs to the category of **Heat Sinks**, which are passive heat exchangers used to dissipate thermal energy from electronic devices. --- ### Technical Specifications | Parameter | Specification Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 25mm | | **Thermal Resistance** | 10.97°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### Component Breakdown #### 1. The Heat Sink Body The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" finish isn't just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation cooling. #### 2. The Mounting Mechanism (pushPIN™) The "F" and "R0" in the part number often refer to the mounting hardware. This model uses a **push-pin and brass spring** system. * **Ease of Use:** It allows for quick assembly to the PCB. * **Constant Pressure:** The spring ensures a consistent attachment force, which optimizes the interface between the heat sink and the heat-generating component (like a BGA or CPU). #### 3. Thermal Interface Material (TIM) This part number typically comes with a pre-applied **T766** thermal phase-change material or a high-performance thermal pad on the base. This fills the microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ### Applications The ATS-03F-82-C3-R0 is designed for compact electronic environments where space is limited but cooling is critical: * **Telecommunications:** Cooling for network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. --- ### Part Number Deciphering The nomenclature follows a specific logic: * **ATS:** Manufacturer prefix. * **03:** Specific series/design. * **F:** Fine pitch or specific attachment variant. * **82:** Specific height/dimension code. * **C3:** Material/Thermal performance grade. * **R0:** RoHS compliance/Revision status.
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a push-pin mount over adhesive tape for heat sinks?
    • ⤷ How does air velocity (LFM) affect the thermal resistance of this component?
    • ⤷ Are there copper versions of this heat sink for higher thermal conductivity?