The part number **ATS-03F-87-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 12.7mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific logic used by ATS to identify the part's build: * **ATS**: Manufacturer prefix. * **03F**: Refers to the specific series and mounting hole configuration. * **87**: Designates the specific fin geometry and height (12.7mm). * **C3**: Indicates the thermal performance grade and material (Aluminum with Blue Anodized finish). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Cooling Features The ATS-03F-87-C3-R0 is engineered for specific thermal management scenarios: * **Push-Pin Mounting**: It uses a plastic push-pin and spring system. This provides a consistent "clamping force" on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **T412 Thermal Interface**: The heatsink comes with a pre-applied phase-change material or thermal tape. This eliminates the need for external thermal paste and ensures a low-resistance heat path from the component to the aluminum fins. * **Airflow Optimization**: The straight-fin design is optimized for environments with forced air (fans). The 12.7mm height (low profile) makes it suitable for tight spaces like 1U servers or compact embedded systems. --- ### 4. Typical Applications These heatsinks are commonly found in: 1. **Telecommunications**: Cooling ASICs and FPGAs in networking switches. 2. **Computing**: Northbridge/Southbridge cooling on motherboards. 3. **Industrial Controls**: Thermal management for power modules and motor drivers.