The **ATS-03F-92-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series and is designed for thermal management of electronic components such as CPUs, GPUs, and other high-heat-generating ICs. --- ### 1. Technical Specifications The component is characterized by its physical dimensions and its ability to dissipate heat under various airflow conditions. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 15.00 mm | | **Thermal Resistance** | 16.48 °C/W (Unducted Flow @ 100 LFM) | | **Fin Pitch** | Fine Pitch | | **Fin Pattern** | Straight | --- ### 2. Key Component Features ### A. Material and Coating The heat sink is made from **Aluminum**, which offers a balance of lightweight properties and high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiative cooling. ### B. pushPIN™ Mounting System The "92" in the part number refers to the specific attachment mechanism. * **Spring-loaded pins:** These provide a precise, consistent pressure against the electronic component to ensure optimal thermal contact. * **Compatibility:** It is designed for pre-drilled holes in the PCB, reducing the risk of component damage during installation. ### C. Thermal Performance The efficiency of this part is measured by its thermal resistance (lower is better). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.48 | | 300 (1.5 m/s) | 6.69 | | 500 (2.5 m/s) | 4.46 | --- ### 3. Part Number Decoding (ATS-03F-92-C2-R0) To understand the electronic application, we can break down the SKU: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **03:** Series number. * **F:** Fin pitch/style (Fine). * **92:** Specific pushPIN™ attachment style and hole spacing. * **C2:** Material/Color code (Aluminum, Blue Anodized). * **R0:** Revision code. --- ### 4. Application Usage This part is typically found in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.