ATS-03F-94-C2-R0
AI

The **ATS-03F-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation on Printed Circuit Boards (PCBs).
### 1. Technical Specifications
The following table summarizes the core physical and thermal characteristics:
| Property | Value / Detail |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimension (Length x Width)** | 40mm x 40mm |
| **Height** | 25mm |
| **Thermal Resistance** | 14.63 °C/W (at 100 LFM) |
| **Flow Pattern** | Vertical (Cross-Cut) |
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### 2. Key Features and Electronic Design
* **Thermal Performance:** The "Cross-Cut" fin design allows for multi-directional airflow, making it ideal for electronics where the direction of the cooling fan's exhaust might vary.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides:
* **Consistent Pressure:** Ensures optimal contact with the semiconductor (CPU/GPU/FPGA).
* **Secure Attachment:** Resists vibration and mechanical shock better than thermal tape.
* **Material Science:** The aluminum construction offers a lightweight profile while the blue anodized finish increases surface emissivity and provides corrosion resistance.
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### 3. Common Applications
This specific part is typically found in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed networking chips.
2. **Embedded Systems:** For industrial PCs where vertical space (25mm) is available.
3. **Power Supplies:** Managing heat in MOSFETs or voltage regulators.
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### 4. Thermal Resistance Table (Airflow Performance)
Thermal performance changes based on the Linear Feet per Minute (LFM) of airflow:
| Velocity (LFM) | 100 | 200 | 400 | 600 |
| :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow (°C/W)** | 14.63 | 5.27 | 3.00 | 2.13 |
| **Ducted Flow (°C/W)** | 3.63 | 2.34 | 1.92 | 1.68 |
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- ⤷
What is the difference between ducted and unducted flow for this heat sink?
- ⤷ What type of thermal interface material (TIM) is recommended for the ATS-03F-94-C2-R0?
- ⤷ How do I determine if the 25mm height will fit my PCB enclosure?