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  • ATS-03F-94-C2-R0

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    The **ATS-03F-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation on Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the core physical and thermal characteristics: | Property | Value / Detail | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 40mm x 40mm | | **Height** | 25mm | | **Thermal Resistance** | 14.63 °C/W (at 100 LFM) | | **Flow Pattern** | Vertical (Cross-Cut) | --- ### 2. Key Features and Electronic Design * **Thermal Performance:** The "Cross-Cut" fin design allows for multi-directional airflow, making it ideal for electronics where the direction of the cooling fan's exhaust might vary. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides: * **Consistent Pressure:** Ensures optimal contact with the semiconductor (CPU/GPU/FPGA). * **Secure Attachment:** Resists vibration and mechanical shock better than thermal tape. * **Material Science:** The aluminum construction offers a lightweight profile while the blue anodized finish increases surface emissivity and provides corrosion resistance. --- ### 3. Common Applications This specific part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial PCs where vertical space (25mm) is available. 3. **Power Supplies:** Managing heat in MOSFETs or voltage regulators. --- ### 4. Thermal Resistance Table (Airflow Performance) Thermal performance changes based on the Linear Feet per Minute (LFM) of airflow: | Velocity (LFM) | 100 | 200 | 400 | 600 | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 14.63 | 5.27 | 3.00 | 2.13 | | **Ducted Flow (°C/W)** | 3.63 | 2.34 | 1.92 | 1.68 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted flow for this heat sink?
    • ⤷ What type of thermal interface material (TIM) is recommended for the ATS-03F-94-C2-R0?
    • ⤷ How do I determine if the 25mm height will fit my PCB enclosure?