The **ATS-03F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling of semiconductor devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass Springs/Plastic Pins) | | **Thermal Resistance** | 5.63°C/W @ 100 LFM | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | | **Flow Pattern** | maxiFLOW™ (Optimized for directional airflow) | | **Compliance** | RoHS Compliant | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, FPGAs, or power transistors. By increasing the surface area, it prevents thermal throttling or hardware failure caused by overheating. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "R0" suffix indicates a pushPIN™ mounting system. This provides: * **Constant Pressure:** Ensures optimal contact between the heat sink and the electronic component. * **Vibration Resistance:** Securely holds the part in place during mechanical stress. * **Ease of Rework:** Can be removed and re-installed without damaging the PCB. #### C. maxiFLOW™ Fin Geometry The fin design is tapered and spread out to maximize the surface area while minimizing pressure drop. This is critical in electronics where space is tight and cooling fans provide limited airflow. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific role in a circuit assembly: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **03:** Sequence or series identifier. * **F:** Fin pitch/style. * **96:** Specific length/width configuration. * **C2:** Material/Finish (Blue Anodized Aluminum). * **R0:** Packaging or mounting revision (PushPIN version). --- ### 4. Application Scenarios * **Telecommunications:** Cooling network switches and routers. * **Industrial PCs:** Thermal regulation for embedded systems. * **Power Supplies:** Heat dissipation for MOSFETs or bridge rectifiers.