The **ATS-03F-98-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Construction The heatsink is engineered to dissipate heat from surface-mount components into the surrounding air. * **Fin Configuration:** It uses a straight-fin design, which is optimal for systems with a clear path for airflow (longitudinal airflow). * **Material Choice:** Aluminum is used for its excellent thermal conductivity-to-weight ratio. * **Surface Treatment:** The **Blue Anodization** is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. --- ### 3. Attachment Mechanism (The "Push-Pin") The "03F" and "R0" designations in the part number signify the hardware used for mounting: * **Plastic Push-Pins:** These allow for tool-less installation into pre-drilled holes on the PCB. * **Brass/Steel Springs:** These provide a specific "compression force" (preload) to ensure the base of the heatsink stays in tight contact with the electronic chip, maximizing thermal transfer across the Thermal Interface Material (TIM). --- ### 4. Thermal Performance Data Performance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.31 | | 300 | 1.5 | 5.07 | | 500 | 2.5 | 3.52 | | 700 | 3.5 | 2.85 | --- ### 5. Application Use Cases This component is typically found in: * **Networking Equipment:** Routers, switches, and base stations. * **Industrial PCs:** Cooling chipsets or embedded processors. * **Power Supplies:** Cooling MOSFETs or voltage regulators.