The **ATS-03H-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* Below is a detailed breakdown of its technical specifications and physical characteristics. ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | pushPIN™ HS Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | --- ### 2. Thermal Performance This component is designed to dissipate heat from integrated circuits (ICs) and CPUs. Its efficiency is measured by Thermal Resistance ($^\circ\text{C/W}$). * **Thermal Resistance (Unducted Flow):** 20.17 $^\circ\text{C/W}$ @ 100 LFM * **Thermal Resistance (Ducted Flow):** 4.56 $^\circ\text{C/W}$ @ 100 LFM * **Performance Trend:** As airflow (LFM) increases, the thermal resistance drops significantly, allowing for better cooling. --- ### 3. Physical Dimensions The "06" in the part number indicates the specific fin profile and height configuration within the series. | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 40.00 mm | | **Width (B)** | 40.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (E)** | 33.00 mm (Hole spacing) | | **Pitch (F)** | 33.00 mm (Hole spacing) | --- ### 4. Key Electronic Features * **Fin Design:** It utilizes a **Fine Pitch** pattern which increases the surface area for heat exchange without significantly increasing the footprint. * **TIM (Thermal Interface Material):** The "R0" suffix typically denotes that the unit comes with a pre-applied thermal interface material (like T766) to ensure maximum heat transfer between the chip and the aluminum base. * **Push-Pin Attachment:** The assembly uses a flexible, spring-loaded push-pin mechanism. This provides: 1. **Uniform Pressure:** Ensures the heat sink stays flat against the component. 2. **Ease of Assembly:** No specialized tools are required for board mounting. 3. **Vibration Resistance:** The springs absorb mechanical shock, protecting the solder joints of the underlying BGA/LGA components.