The **ATS-03H-41-C2-R0** is a high-performance electronic component specifically designed for **thermal management**. It is an aluminum heat sink manufactured by *Advanced Thermal Solutions (ATS)*, intended to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, and power transistors. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-03H-41-C2-R0 | | **Material** | Aluminum (Blue Anodized Finish) | | **Mounting Type** | pushPIN™ (Spring-loaded attachment) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 10.03° C/W (@ 100 LFM) | | **Fin Style** | Straight Fin | | **Attachment Type** | Push-Pin (Plastic) | --- ### Key Features and Electronic Functionality #### 1. Heat Dissipation Mechanism This part serves as a **passive cooling** solution. In electronics, heat is the primary enemy of component longevity. The ATS-03H-41-C2-R0 increases the surface area of a hot component, allowing air to carry away heat via convection. #### 2. The pushPIN™ Attachment System The "R0" at the end of the part number refers to the specific attachment kit. * **Precision Springs:** Provides a specific amount of "clamping force" to ensure a secure thermal interface between the heat sink and the chip. * **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied, which is a phase-change material that fills microscopic air gaps to improve heat transfer. #### 3. Material and Coating * **6063 Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This isn't just for aesthetics; the anodized layer provides a small degree of electrical insulation and increases surface emissivity, slightly improving radiation cooling. --- ### Thermal Performance Overview | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.03 | | 300 | 1.5 | 3.63 | | 500 | 2.5 | 2.53 | *Note: As airflow increases, the thermal resistance drops significantly, making it highly effective in forced-air (fan-cooled) environments.* ---