The **ATS-03H-52-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 10.79°C/W @ Unducted Flow | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Features #### A. The Heat Sink Body * **Material:** Extruded aluminum, which offers a high thermal conductivity to weight ratio. * **Fin Design:** Features a straight-fin pattern. This is optimized for environments where there is a consistent direction of airflow (ducted or unducted). * **Finish:** The **Blue Anodized** coating is not just for aesthetics; it provides increased surface emissivity and corrosion resistance. #### B. The Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses a **Push-Pin** system: * **Compression Spring:** Provides a consistent "Force" or pressure on the component (BGA/chip), ensuring an airtight interface with the thermal interface material (TIM). * **Pre-Drilled Holes:** Requires specific hole patterns on the PCB for mounting. #### C. Thermal Interface Material (TIM) * The "R0" suffix usually indicates that the heat sink comes with a **pre-applied Thermal Interface Material** (typically a high-performance phase-change material or thermal pad) to ensure efficient heat transfer from the chip to the aluminum base. --- ### 3. Application Use Cases This specific heat sink is typically used for: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Industrial PCs:** Managing heat in fanless or low-airflow enclosures. 3. **Embedded Systems:** Protecting microprocessors from thermal throttling. --- ### 4. Thermal Performance Data Performance varies based on Airflow Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.79 | | 300 (1.5 m/s) | 4.03 | | 500 (2.5 m/s) | 3.12 |