ATS-03H-53-C2-R0
AI

The **ATS-03H-53-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of the blueICE™ series, designed for high-performance cooling of electronic components like CPUs, GPUs, and power modules.
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## Technical Specifications
The following table outlines the physical and thermal properties of the device:
| Property | Value / Description |
| :--- | :--- |
| **Part Number** | ATS-03H-53-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 30mm |
| **Thermal Resistance** | 2.85 °C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## Key Features & Construction
### 1. Thermal Management
The "C2" in the part number indicates a **Blue Anodized** finish. This finish is not just for aesthetics; it provides moderate corrosion resistance and slightly improves radiative heat transfer. The high aspect ratio fins are designed to maximize surface area for heat dissipation.
### 2. pushPIN™ Attachment System
This model uses a specialized attachment mechanism designed for easy installation and consistent pressure:
* **Springs:** Provides a precise amount of force to ensure the base of the heat sink maintains perfect contact with the electronic component.
* **Hardware:** Includes brass or plastic pins that lock into pre-drilled holes on the PCB.
### 3. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a uniform layer that reduces the thermal resistance between the heat source and the aluminum sink.
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## Common Applications
* **Integrated Circuits (ICs):** Cooling FPGAs and ASICs in networking gear.
* **Power Supplies:** Managing heat in high-density power converters.
* **Embedded Computing:** Used in industrial PCs where space is limited but thermal loads are high.
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- ⤷
What are the specific PCB hole requirements for the pushPIN attachment?
- ⤷ How does the air flow rate (LFM) affect the thermal resistance of this heat sink?
- ⤷ Are there alternative finishes available for the ATS-03 series?