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  • ATS-03H-53-C2-R0

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    The **ATS-03H-53-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of the blueICE™ series, designed for high-performance cooling of electronic components like CPUs, GPUs, and power modules. --- ## Technical Specifications The following table outlines the physical and thermal properties of the device: | Property | Value / Description | | :--- | :--- | | **Part Number** | ATS-03H-53-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 30mm | | **Thermal Resistance** | 2.85 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Key Features & Construction ### 1. Thermal Management The "C2" in the part number indicates a **Blue Anodized** finish. This finish is not just for aesthetics; it provides moderate corrosion resistance and slightly improves radiative heat transfer. The high aspect ratio fins are designed to maximize surface area for heat dissipation. ### 2. pushPIN™ Attachment System This model uses a specialized attachment mechanism designed for easy installation and consistent pressure: * **Springs:** Provides a precise amount of force to ensure the base of the heat sink maintains perfect contact with the electronic component. * **Hardware:** Includes brass or plastic pins that lock into pre-drilled holes on the PCB. ### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a uniform layer that reduces the thermal resistance between the heat source and the aluminum sink. --- ## Common Applications * **Integrated Circuits (ICs):** Cooling FPGAs and ASICs in networking gear. * **Power Supplies:** Managing heat in high-density power converters. * **Embedded Computing:** Used in industrial PCs where space is limited but thermal loads are high. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole requirements for the pushPIN attachment?
    • ⤷ How does the air flow rate (LFM) affect the thermal resistance of this heat sink?
    • ⤷ Are there alternative finishes available for the ATS-03 series?