The **ATS-03H-63-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.03° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Pattern** | Square-Pin (High surface area) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. Heat Sink Body The part is made of **Aluminum**, which offers an excellent balance between thermal conductivity and weight. The **Blue Anodized** finish is not just for aesthetics; it increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. #### B. Square-Pin Fin Design Unlike traditional straight-fin heat sinks, the square-pin design allows for "omni-directional" airflow. This means the heat sink can dissipate heat effectively regardless of the direction the cooling fan is blowing across the PCB. #### C. Push-Pin Attachment Mechanism This part uses a mechanical push-pin system. This is preferred in high-vibration environments or industrial applications because: * It provides constant pressure on the high-power electronic component. * It ensures the Thermal Interface Material (TIM) is spread evenly. * It eliminates the risk of the heat sink falling off due to adhesive failure. #### D. Pre-applied TIM (T766) The "C2" in the part number indicates it comes with **T766 thermal grease** already applied to the base. This reduces assembly time and ensures a low thermal resistance path between the electronic chip and the aluminum fins. --- ### 3. Typical Applications The ATS-03H-63-C2-R0 is commonly used to cool: 1. **Northbridge/Southbridge** chips on motherboards. 2. **Power supplies** and high-voltage regulators. 3. **ASIC and FPGA** processors in networking equipment. 4. **Embedded systems** where vertical space is limited to 20mm. ---