The **ATS-03H-95-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Resistance** | 7.29°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Component Parts The assembly is composed of several electronic-mechanical elements designed to manage heat: #### A. The Heatsink Body * **Material:** Extruded aluminum, which provides a balance between weight and thermal conductivity. * **Fin Geometry:** It features a "straight fin" design. This is optimized for **undirected airflow**, allowing air to pass through the fins from multiple directions to dissipate heat. * **Anodization:** The blue coating isn't just for aesthetics; it increases the surface emissivity and protects the aluminum from oxidation. #### B. The Push-Pin Fasteners * These are plastic rivets with internal springs. * **Function:** They provide a standardized amount of "pressure" (clamping force) on the chip to ensure maximum surface contact without cracking the silicon die or the PCB. #### C. Thermal Interface Material (TIM) * The bottom surface comes with **T766** pre-applied. * **Function:** This is a phase-change or grease-like material that fills microscopic air gaps between the heatsink base and the electronic component (e.g., a BGA chip). --- ### 3. Thermal Performance Metrics Thermal resistance is measured in °C/W (degrees Celsius per Watt). The lower the number, the better the cooling. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.29 | | 200 | 1.0 | 5.88 | | 400 | 2.0 | 4.41 | --- ### 4. Typical Applications * **BGA (Ball Grid Array) Cooling:** Used on networking chips, FPGAs, and microprocessors. * **Embedded Systems:** Industrial PCs where active fan cooling may be limited. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators on a PCB.