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  • ATS-04A-01-C2-R0

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    The **ATS-04A-01-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. ### 1. Technical Specifications The following table outlines the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04A-01-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 21.90°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Components & Design The "electronic" functionality of this part is purely passive, serving as a thermal management interface for active semiconductors. * **Heat Dissipation Mechanism:** The straight fin design is optimized for high-velocity airflow environments (forced convection). The low profile (10mm) makes it ideal for compact electronic enclosures (1U or 2U servers). * **Attachment (Push Pins):** Unlike adhesive-based heat sinks, this uses brass push pins with a built-in spring mechanism. This ensures: * **Consistent Pressure:** Provides uniform contact between the heat sink and the chip. * **Reliability:** Mechanical attachment is more vibration-resistant than thermal tape. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-PPS-01**, a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink. ### 3. Common Applications This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling for ASICs and high-speed networking chips. 2. **Embedded Systems:** Microcontrollers and SoCs that generate localized heat. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators in DC-DC converters. --- ### 4. Part Number Breakdown (Nomenclature) Understanding the code helps in selecting the right variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **04** | Series Type (Push-Pin series) | | **A** | Material (Aluminum) | | **01** | Specific Dimension/Fin Configuration | | **C2** | Thermal Interface Material (Pre-applied) | | **R0** | RoHS Compliant Version |
    ✨ Follow-up Questions
    • ⤷What is the difference between this heat sink and a cross-cut fin design?
    • ⤷ How do I calculate if the 21.90°C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there different spring tensions available for this push-pin model?