ATS-04A-01-C2-R0
AI

The **ATS-04A-01-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules.
### 1. Technical Specifications
The following table outlines the primary physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-04A-01-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Brass) |
| **Thermal Resistance** | 21.90°C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm |
| **Fin Style** | Straight Fin |
---
### 2. Key Electronic Components & Design
The "electronic" functionality of this part is purely passive, serving as a thermal management interface for active semiconductors.
* **Heat Dissipation Mechanism:** The straight fin design is optimized for high-velocity airflow environments (forced convection). The low profile (10mm) makes it ideal for compact electronic enclosures (1U or 2U servers).
* **Attachment (Push Pins):** Unlike adhesive-based heat sinks, this uses brass push pins with a built-in spring mechanism. This ensures:
* **Consistent Pressure:** Provides uniform contact between the heat sink and the chip.
* **Reliability:** Mechanical attachment is more vibration-resistant than thermal tape.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-PPS-01**, a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink.
### 3. Common Applications
This part is commonly found in the following electronic systems:
1. **Telecommunications:** Cooling for ASICs and high-speed networking chips.
2. **Embedded Systems:** Microcontrollers and SoCs that generate localized heat.
3. **Power Supplies:** Cooling MOSFETs or voltage regulators in DC-DC converters.
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### 4. Part Number Breakdown (Nomenclature)
Understanding the code helps in selecting the right variant:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) |
| **04** | Series Type (Push-Pin series) |
| **A** | Material (Aluminum) |
| **01** | Specific Dimension/Fin Configuration |
| **C2** | Thermal Interface Material (Pre-applied) |
| **R0** | RoHS Compliant Version |
- ⤷What is the difference between this heat sink and a cross-cut fin design?
- ⤷ How do I calculate if the 21.90°C/W thermal resistance is sufficient for my chip?
- ⤷ Are there different spring tensions available for this push-pin model?