ATS-04A-07-C2-R0
AI

The **ATS-04A-07-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 16.97°C/W (Unducted Flow) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Key Design Components
### A. Push-Pin Attachment
The model uses a specific mechanical attachment system:
* **Ease of Assembly:** Features a spring-loaded push-pin mechanism that secures the heat sink to the PCB through pre-drilled holes.
* **Consistent Pressure:** The spring ensures uniform pressure across the component surface, which optimizes heat transfer.
### B. Thermal Interface Material (TIM)
The **C2** suffix in the part number indicates that it comes with **T766** thermal grease pre-applied.
* This eliminates the need for manual application.
* T766 is designed to fill microscopic air gaps between the component and the heat sink base.
### C. Fin Geometry
* **Low Profile:** At only 10mm high, it is suitable for space-constrained enclosures (1U or 2U server blades).
* **Airflow Efficiency:** The straight fin design is optimized for environments with directed airflow (forced convection).
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## 3. Part Number Breakdown (Nomenclature)
To understand variations of this part, here is how the model code is structured:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **04** | Series Number |
| **A** | Aluminum Material |
| **07** | Dimension Reference (45x45mm) |
| **C2** | Thermal Interface Material (T766) |
| **R0** | RoHS Compliant / Revision Status |
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- ⤷
What are the alternative attachment methods if the PCB does not have holes for push-pins?
- ⤷ How does the thermal resistance change at different airflow velocities (LFM)?
- ⤷ Is there a version of this heat sink with a copper base for higher thermal conductivity?