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  • ATS-04A-07-C2-R0

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    The **ATS-04A-07-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 16.97°C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Design Components ### A. Push-Pin Attachment The model uses a specific mechanical attachment system: * **Ease of Assembly:** Features a spring-loaded push-pin mechanism that secures the heat sink to the PCB through pre-drilled holes. * **Consistent Pressure:** The spring ensures uniform pressure across the component surface, which optimizes heat transfer. ### B. Thermal Interface Material (TIM) The **C2** suffix in the part number indicates that it comes with **T766** thermal grease pre-applied. * This eliminates the need for manual application. * T766 is designed to fill microscopic air gaps between the component and the heat sink base. ### C. Fin Geometry * **Low Profile:** At only 10mm high, it is suitable for space-constrained enclosures (1U or 2U server blades). * **Airflow Efficiency:** The straight fin design is optimized for environments with directed airflow (forced convection). --- ## 3. Part Number Breakdown (Nomenclature) To understand variations of this part, here is how the model code is structured: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Series Number | | **A** | Aluminum Material | | **07** | Dimension Reference (45x45mm) | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision Status | ---
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods if the PCB does not have holes for push-pins?
    • ⤷ How does the thermal resistance change at different airflow velocities (LFM)?
    • ⤷ Is there a version of this heat sink with a copper base for higher thermal conductivity?