The **ATS-04A-08-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in tight spaces. Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 14.61° C/W (Unducted flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions This component is designed with a square footprint to fit standard electronic chip packages (like BGAs or FPGAs). * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 7.50 mm (Low profile) * **Fin Pitch:** Specialized flared fin design for maximum surface area. --- ### 3. Key Electronic Applications The ATS-04A-08-C2-R0 is typically used in industrial and consumer electronics where heat dissipation is critical for component longevity: 1. **Telecommunications:** Used on high-speed switching chips and routers. 2. **Embedded Computing:** Cooling for SoCs (System on Chips) and microprocessors. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 4. **Automotive:** Cooling sensors and control units in high-temperature environments. --- ### 4. Design Advantages * **Flared Fin Geometry:** Unlike straight-fin heat sinks, the maxiFLOW design uses flared fins to increase air turbulence and surface area, significantly improving cooling performance in low-airflow environments. * **pushPIN™ Attachment:** The "R0" suffix indicates the use of pushPIN™ hardware, which provides a precise, repeatable pressure on the electronic component, ensuring optimal contact with the Thermal Interface Material. * **Low Profile:** At only 7.5mm high, it is ideal for 1U rackmount servers or compact mobile devices where vertical space is limited. ---