The **ATS-04A-41-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*, designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 40.00mm x 40.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 10.02°C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### Core Components and Features #### 1. The Heat Sink Body (Aluminum) The body is made of extruded aluminum, chosen for its high thermal conductivity and lightweight properties. The "Straight Fin" design allows for efficient airflow through the gaps, transferring heat from the base to the surrounding air. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **ATS-04A-41-C2-R0** uses a specialized mechanical attachment system: * **Push Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the component (CPU/GPU/FPGA), which is critical for heat transfer. #### 3. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes pre-applied with a **Thermal Interface Material**. This fills the microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; the anodization process provides: * Increased surface area for radiation. * Corrosion resistance. * Electrical insulation to prevent short circuits if the sink accidentally touches other components. --- ### Typical Applications This part is commonly used in high-density electronic environments where airflow is managed, such as: * Telecommunications equipment. * High-speed networking switches. * Embedded computing systems. * Power supplies.