Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-04A-85-C2-R0

  • AI
    The **ATS-04A-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like BGAs and CPUs in tight spaces. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 25.00mm | | **Attachment Method** | pushPIN™ | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Thermal Resistance** | 2.50°C/W @ 200 LFM | | **Compatibility** | BGA, ASIC, Chipsets | --- ### 2. Key Electronic Features #### A. Fin Geometry (maxiFLOW™) Unlike standard extruded heat sinks, the **maxiFLOW™** design features a spread-fin geometry. This increases the surface area and maximizes airflow through the fin field, significantly reducing thermal resistance compared to traditional designs. #### B. pushPIN™ Attachment The part uses the **pushPIN™** mounting system, which is critical for electronic PCB assembly: * **Precision Springs:** Ensures a specific pressure is applied to the chip, optimizing the Thermal Interface Material (TIM) performance. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Hole Pattern:** Specifically designed for standard PCB layouts. #### C. Thermal Performance Data Thermal management effectiveness depends on the airflow (LFM - Linear Feet per Minute): * **Unducted Flow:** 4.40°C/W @ 100 LFM. * **High Velocity Flow:** 1.60°C/W @ 600 LFM. --- ### 3. Application Use Cases This component is typically found in high-reliability electronic systems where heat dissipation is a bottleneck: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Compact motherboards requiring passive or semi-active cooling. 3. **Power Supplies:** Cooling voltage regulators or power transistors. --- ### 4. Part Number Breakdown The nomenclature `ATS-04A-85-C2-R0` can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04A:** Series identifier. * **85:** Specific dimensions/height configuration. * **C2:** Material/Finish indicator (Blue Anodized Aluminum). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the recommended thermal interface materials (TIM) to use with this heat sink?
    • ⤷ How does the pushPIN mounting system compare to adhesive-based heat sinks?
    • ⤷ What is the specific PCB hole pattern required for the ATS-04A-85-C2-R0?