The **ATS-04A-87-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04A-87-C2-R0 | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material (TIM)** | T766 (High-performance pre-applied phase change) | | **Finish** | Blue Anodized | --- ### Physical Dimensions The physical footprint is critical for ensuring compatibility with the Printed Circuit Board (PCB) layout. | Dimension | Value | | :--- | :--- | | **Length/Width** | 35.00 mm x 35.00 mm | | **Height** | 20.00 mm | | **Pitch (Hole spacing)** | 42.00 mm | --- ### Component Breakdown #### 1. Heat Sink Body The body is made of **AL6063 aluminum**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity, which improves heat dissipation via radiation. #### 2. Fin Geometry It uses a **Straight Fin** design. This is optimized for systems with a defined airflow direction. Straight fins allow air to pass through the length of the sink with minimal pressure drop compared to cross-cut or pin-fin designs. #### 3. Push-Pin Attachment Instead of using messy adhesives or permanent thermal tape, this part uses a mechanical **Push-Pin and Spring** mechanism. * **Reliability:** Ensures constant pressure on the electronic component, maximizing heat transfer. * **Installation:** Requires pre-drilled holes in the PCB. #### 4. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a phase-change material that softens when the component heats up, filling microscopic air gaps between the chip and the heat sink to reduce thermal resistance. --- ### Performance Overview (Thermal Resistance) Thermal resistance indicates how effectively the part moves heat away from the silicon. * **@ 100 LFM (0.5 m/s):** ~13.12 °C/W * **@ 500 LFM (2.5 m/s):** ~4.32 °C/W * **@ 800 LFM (4.0 m/s):** ~3.40 °C/W *Note: Higher airflow (LFM) significantly increases the efficiency of this specific model.*