The **ATS-04A-99-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed to provide thermal management for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 11.51 °C/W (at 1.0 m/s airflow) | | **Fin Pattern** | Cross-Cut | --- ### 2. Breakdown of the Part Number The part number is a coded string representing the physical configuration of the heat sink: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **04**: Series number (pushPIN™ Heat Sink). 3. **A**: Attachment Material (usually plastic or brass pins). 4. **99**: Specific footprint/design identifier. 5. **C2**: Thermal Interface Material (TIM). "C2" indicates the use of **T766** (a high-performance thermal grease). 6. **R0**: RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not contain circuits), its role in an electronic system is critical for: * **Thermal Dissipation**: Conducts heat away from the semiconductor die through the base and radiates it via the aluminum fins. * **Component Reliability**: By lowering the operating temperature, it prevents thermal throttling and extends the Mean Time Between Failures (MTBF) of the processor. * **Structural Support**: The pushPIN™ system provides a precise, repeatable pressure (spring force) to ensure optimal contact between the heat sink and the electronic chip without damaging the PCB. --- ### 4. Application Use-Cases * **BGA Packaging**: Ideal for cooling Ball Grid Array (BGA) components. * **Industrial PCs**: Used in fanless or low-airflow environments where efficient fin design is required. * **Telecommunications**: Cooling high-speed networking chips.