The **ATS-04B-01-C3-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 18.50°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 6mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Component Breakdown #### A. Thermal Management Role The ATS-04B-01-C3-R0 acts as a **passive heat exchanger**. Its primary electronic role is to conduct heat away from a semiconductor junction to the surrounding air, preventing thermal throttling or component failure. #### B. The "Push-Pin" Attachment Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Plastic Push Pins:** These snap into pre-drilled holes on the PCB. * **Compression Springs:** They provide consistent downward pressure, ensuring a tight "thermal interface" between the heat sink base and the electronic chip. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied **Thermal Interface Material**. This is a phase-change material or thermal pad that fills microscopic air gaps between the chip and the aluminum to maximize heat transfer. --- ### 3. Part Number Decoder ATS part numbers follow a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04:** Part of the "Push-Pin" heat sink series. * **B:** Specific series/fin geometry. * **01:** Dimension code (40mm x 40mm). * **C3:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Packaging or TIM specification. --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microcontrollers or FPGAs. * **Networking:** Cooling small switches or router chips. * **Automotive Electronics:** Thermal management for sensors and control units.