The **ATS-04B-129-C2-R0** is a high-performance electronic component belonging to the **Heat Sink** category, specifically part of the "pushPIN™" thermal management line manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part is designed for cooling electronic components (such as CPUs, GPUs, or FPGAs) by dissipating heat into the surrounding air. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Fin Pattern** | XCUT (Cross-cut) | | **Base Weight** | ~115 grams | --- ### 2. Design Characteristics The ATS-04B-129-C2-R0 utilizes several specific engineering features to maximize thermal efficiency: * **XCUT Fin Profile:** This design features vertical and horizontal cuts in the fins. This creates a larger surface area and allows for air to flow through the sink from multiple directions, making it ideal for systems with variable airflow directions. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this uses a spring-loaded pin mechanism. This ensures: 1. **Uniform Pressure:** Prevents damage to the sensitive silicon die. 2. **Secure Mounting:** High vibration resistance. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase-change material or grease, ensuring low thermal resistance between the heat source and the aluminum base. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **04** | Product Family / Series | | **B** | Attachment Style (pushPIN™) | | **129** | Specific dimension/thermal profile ID | | **C2** | Thermal Performance Grade / Material | | **R0** | Revision code or packaging variant | --- ### 4. Application Use Cases * **PCB Cooling:** Ideal for high-heat density surface mount components. * **Telecommunications:** Used in routers and switches where airflow is provided by system fans. * **Industrial PCs:** Suited for environments with high vibration where a secure mechanical attachment is necessary.