The **ATS-04B-137-C2-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push pin" attachment series designed to cool electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 10.00mm | | **Thermal Resistance** | 18.30°C/W (Natural Flow) | | **Fin Style** | Fine Pitch (Straight Fin) | | **TIM (Interface Material)** | T766 (Pre-applied) | --- ### 2. Design Breakdown Understanding the electronic and mechanical design of this part is crucial for thermal management: * **Heat Dissipation Geometry:** The "straight fin" design is optimized for airflow directed through the fins. At 10mm height, it is a low-profile solution suitable for compact PCBs (Printed Circuit Boards). * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses brass push-pins. This provides constant pressure (via springs) against the chip, ensuring a better thermal interface and higher mechanical stability against vibrations. * **Material Selection:** Aluminum is chosen for its balance of high thermal conductivity and light weight. The Blue Anodized finish protects against corrosion and improves emissivity. * **TIM (Thermal Interface Material):** The "T766" designation indicates a pre-applied phase-change or grease-like material on the base, which fills microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Metrics The effectiveness of this heat sink depends on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Natural Convection** | 18.30 | | **200 LFM** | 6.60 | | **400 LFM** | 5.30 | | **600 LFM** | 4.60 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling microcontrollers or small FPGAs. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Cooling voltage regulators or small power modules.