The **ATS-04B-150-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed specifically for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 25mm | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 4.82°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Structure (Straight Fin) The **straight fin** design is optimized for environments with consistent airflow (forced convection). The spacing between fins allows air to pass through with relatively low pressure drop while maximizing the surface area for heat dissipation. #### B. Push Pin Attachment Mechanism Instead of using messy adhesives or complicated brackets, this part uses a **plastic or brass push pin** system. * **Spring-loaded:** Ensures a constant, uniform pressure on the electronic chip, which improves thermal transfer. * **Reliability:** Mechanical fastening is more vibration-resistant than thermal tape. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Purpose:** Fills microscopic air gaps between the heat sink and the electronic component. * **Benefit:** Reduces thermal contact resistance immediately upon installation. --- ### 3. Electronic Application Use-Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling ASICs in switches and routers. 2. **Embedded Systems:** High-speed processors in industrial PCs. 3. **Power Electronics:** Managing heat for MOSFET arrays or voltage regulators. ---