ATS-04B-151-C1-R0
AI

The **ATS-04B-151-C1-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 3.90°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 20.0mm |
| **Finish** | Blue Anodized |
| **Fin Style** | Straight Fin (Extrusion) |
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### 2. Component Analysis
#### A. Attachment Mechanism: Push-Pin
The "R0" suffix indicates a standard push-pin attachment. This uses a plastic or metal pin with a compressed spring to create a secure, consistent downward force on the component.
* **Benefit:** Ensures reliable contact with the thermal interface material (TIM).
* **Requirement:** Requires pre-drilled holes on the PCB (Printed Circuit Board).
#### B. Thermal Performance
The unit is designed for **forced air cooling** (convection).
* **At 200 LFM (Linear Feet per Minute):** 3.90°C/W.
* **At 500 LFM:** Approximately 2.40°C/W.
* **Passive Cooling:** It is less efficient in natural convection environments due to the density of the fins.
#### C. Material and Finish
The heat sink is made of **Aluminum 6063**. The **Blue Anodized** finish is not just for aesthetics; it provides:
* Increased corrosion resistance.
* Improved surface emissivity for better radiation heat transfer.
* Electrical insulation (to a minor degree) on the surface of the metal.
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### 3. Common Applications
* **Telecommunications:** Cooling of high-speed network switches.
* **Embedded Systems:** Industrial PC processors.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Consumer Electronics:** Video processing chips or FPGA units.
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### 4. Dimensional Diagram (Abstract)
```text
35.0mm (W)
<---------------->
__________________ ^
| || || || || || || | 20.0mm (H)
|_||_||_||_||_||_|| v
------------------
<---------------->
35.0mm (L)
```
- ⤷
What are the PCB hole diameter requirements for the ATS-04B-151-C1-R0 push-pins?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
- ⤷ What is the weight of this specific heat sink model?