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  • ATS-04B-151-C1-R0

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    The **ATS-04B-151-C1-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 3.90°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 20.0mm | | **Finish** | Blue Anodized | | **Fin Style** | Straight Fin (Extrusion) | --- ### 2. Component Analysis #### A. Attachment Mechanism: Push-Pin The "R0" suffix indicates a standard push-pin attachment. This uses a plastic or metal pin with a compressed spring to create a secure, consistent downward force on the component. * **Benefit:** Ensures reliable contact with the thermal interface material (TIM). * **Requirement:** Requires pre-drilled holes on the PCB (Printed Circuit Board). #### B. Thermal Performance The unit is designed for **forced air cooling** (convection). * **At 200 LFM (Linear Feet per Minute):** 3.90°C/W. * **At 500 LFM:** Approximately 2.40°C/W. * **Passive Cooling:** It is less efficient in natural convection environments due to the density of the fins. #### C. Material and Finish The heat sink is made of **Aluminum 6063**. The **Blue Anodized** finish is not just for aesthetics; it provides: * Increased corrosion resistance. * Improved surface emissivity for better radiation heat transfer. * Electrical insulation (to a minor degree) on the surface of the metal. --- ### 3. Common Applications * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Industrial PC processors. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Consumer Electronics:** Video processing chips or FPGA units. --- ### 4. Dimensional Diagram (Abstract) ```text 35.0mm (W) <----------------> __________________ ^ | || || || || || || | 20.0mm (H) |_||_||_||_||_||_|| v ------------------ <----------------> 35.0mm (L) ```
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the ATS-04B-151-C1-R0 push-pins?
    • ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
    • ⤷ What is the weight of this specific heat sink model?