ATS-04B-154-C2-R0
AI

The **ATS-04B-154-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body), Copper (Optional Base) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height (H)** | 15mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 7.51°C/W (Unducted Flow) |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### 2. Key Component Features
#### A. The Heat Sink Geometry
* **Fin Style:** Straight-fin design. This is optimized for airflow from a fan (active cooling) or natural convection.
* **Surface Area:** The 40x40mm footprint is a standard size for many integrated circuits (ICs) and voltage regulators.
#### B. The pushPIN™ Attachment System
This part uses a specific mounting mechanism rather than adhesive tape or clips:
* **Spring-loaded Bolts:** Provides consistent pressure (clamping force) across the component to ensure maximum heat transfer.
* **Tool-less/Quick Install:** Designed for rapid assembly in manufacturing environments.
#### C. Thermal Interface Material (TIM)
The **C2** in the part number indicates it comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance.
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### 3. Part Number Breakdown
Understanding the nomenclature helps identify the exact variant:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **04:** Part of the pushPIN™ series.
* **B:** Standard series indicator.
* **154:** Specific size/fin configuration code.
* **C2:** Thermal Interface Material (T766) and color/finish code.
* **R0:** Revision/Packaging code.
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### 4. Application Use Cases
This electronic part is typically found in:
1. **Networking Hardware:** Switches, routers, and gateways.
2. **Embedded Systems:** Industrial PCs and single-board computers.
3. **Power Supplies:** Cooling MOSFETs or power conversion modules.
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What are the differences between the C1 and C2 versions of this heat sink?
- ⤷ How do I calculate the thermal resistance required for my specific chip?
- ⤷ What is the recommended hole diameter for the pushPIN mounting system?