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  • ATS-04B-154-C2-R0

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    The **ATS-04B-154-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (H)** | 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.51°C/W (Unducted Flow) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The Heat Sink Geometry * **Fin Style:** Straight-fin design. This is optimized for airflow from a fan (active cooling) or natural convection. * **Surface Area:** The 40x40mm footprint is a standard size for many integrated circuits (ICs) and voltage regulators. #### B. The pushPIN™ Attachment System This part uses a specific mounting mechanism rather than adhesive tape or clips: * **Spring-loaded Bolts:** Provides consistent pressure (clamping force) across the component to ensure maximum heat transfer. * **Tool-less/Quick Install:** Designed for rapid assembly in manufacturing environments. #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates it comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the exact variant: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04:** Part of the pushPIN™ series. * **B:** Standard series indicator. * **154:** Specific size/fin configuration code. * **C2:** Thermal Interface Material (T766) and color/finish code. * **R0:** Revision/Packaging code. --- ### 4. Application Use Cases This electronic part is typically found in: 1. **Networking Hardware:** Switches, routers, and gateways. 2. **Embedded Systems:** Industrial PCs and single-board computers. 3. **Power Supplies:** Cooling MOSFETs or power conversion modules.
    ✨ Follow-up Questions
    • ⤷ What are the differences between the C1 and C2 versions of this heat sink?
    • ⤷ How do I calculate the thermal resistance required for my specific chip?
    • ⤷ What is the recommended hole diameter for the pushPIN mounting system?