ATS-04B-157-C2-R0
AI

The **ATS-04B-157-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits.
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## Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm |
| **Fin Pattern** | Fine-Pitch (Straight) |
| **Thermal Resistance** | 3.35°C/W (at 100 LFM) |
| **Spring Type** | ATS-PP-02 |
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## Key Components and Design Features
### 1. Thermal Performance
The "C2" in the part number indicates the thermal performance level. This heat sink is designed for **forced air environments**. The fine-pitch fin design maximizes surface area to allow for efficient heat dissipation while maintaining a low pressure drop.
### 2. pushPIN™ Attachment Mechanism
Unlike adhesive-based heat sinks, this model uses a mechanical attachment system:
* **Compression Springs:** Provides precise pressure to the interface material (TIM) for optimal thermal contact.
* **Plastic/Brass Push Pins:** Secured through pre-drilled holes in the PCB.
* **Installation:** High reliability in high-vibration environments compared to "peel-and-stick" methods.
### 3. Material and Coating
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just aesthetic; it provides corrosion resistance and increases surface emissivity, slightly improving radiative heat transfer.
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## Ordering Nomenclature Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **04** | Series Identifier |
| **B** | Pin/Attachment Style |
| **157** | Specific dimension/fin configuration |
| **C2** | Performance/Material Code (Blue Anodized) |
| **R0** | RoHS Compliant / Revision level |
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- ⤷
What are the recommended PCB hole diameters for the pushPIN attachment?
- ⤷ Can this heat sink be used with a standard thermal pad or is paste required?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 500 LFM)?