ATS-04B-16-C2-R0
AI

The **ATS-04B-16-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 54.00 mm x 54.00 mm x 12.70 mm |
| **Fin Type** | Flat Fin |
| **Pitch** | Fine Pitch |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 1.80 °C/W (at 100 LFM) |
| **Weight** | ~40.50 grams |
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### 2. Key Features and Components
* **Heat Sink Body:** Constructed from high-quality aluminum. The blue anodized finish is not just for aesthetics; it provides protection against corrosion and slightly improves thermal emissivity.
* **pushPIN™ Attachment:** This system features a pre-assembled spring-loaded mechanism. It ensures constant, high pressure on the component to maximize heat transfer across the Thermal Interface Material (TIM).
* **Compression Springs:** These maintain consistent force over time and prevent the heat sink from shifting due to mechanical vibration or shock.
* **Thermal Interface Material (TIM):** The "R0" suffix typically indicates that the part comes pre-applied with high-performance thermal grease (Phase Change Material), reducing assembly time and ensuring optimal contact.
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### 3. Performance Analysis
The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM).
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 1.80 |
| 300 (1.5 m/s) | 1.05 |
| 500 (2.5 m/s) | 0.85 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **04:** Series/Type
* **B:** Attachment style
* **16:** Specific product identifier/Length
* **C2:** Material/Finish code (Blue Anodized)
* **R0:** Packaging/TIM application status
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What are the specific hole patterns required for the pushPIN mounting system on this heat sink?
- ⤷ How does the 'Fine Pitch' fin design impact airflow compared to 'Coarse Pitch' alternatives?
- ⤷ Is this heat sink compatible with standard LGA or BGA processor sockets?