Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-04B-16-C2-R0

  • AI
    The **ATS-04B-16-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00 mm x 54.00 mm x 12.70 mm | | **Fin Type** | Flat Fin | | **Pitch** | Fine Pitch | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.80 °C/W (at 100 LFM) | | **Weight** | ~40.50 grams | --- ### 2. Key Features and Components * **Heat Sink Body:** Constructed from high-quality aluminum. The blue anodized finish is not just for aesthetics; it provides protection against corrosion and slightly improves thermal emissivity. * **pushPIN™ Attachment:** This system features a pre-assembled spring-loaded mechanism. It ensures constant, high pressure on the component to maximize heat transfer across the Thermal Interface Material (TIM). * **Compression Springs:** These maintain consistent force over time and prevent the heat sink from shifting due to mechanical vibration or shock. * **Thermal Interface Material (TIM):** The "R0" suffix typically indicates that the part comes pre-applied with high-performance thermal grease (Phase Change Material), reducing assembly time and ensuring optimal contact. --- ### 3. Performance Analysis The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.80 | | 300 (1.5 m/s) | 1.05 | | 500 (2.5 m/s) | 0.85 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **04:** Series/Type * **B:** Attachment style * **16:** Specific product identifier/Length * **C2:** Material/Finish code (Blue Anodized) * **R0:** Packaging/TIM application status
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required for the pushPIN mounting system on this heat sink?
    • ⤷ How does the 'Fine Pitch' fin design impact airflow compared to 'Coarse Pitch' alternatives?
    • ⤷ Is this heat sink compatible with standard LGA or BGA processor sockets?