The **ATS-04B-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components. --- ### 1. Technical Specifications This part is specifically engineered to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Flat Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.30°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Compatibility** | Universal (based on PCB hole spacing) | --- ### 2. Key Components & Design The "Electronic" functionality of this part is passive, meaning it does not use electricity itself but manages the thermal environment of active electronics. * **Heat Sink Base:** Flat bottom designed for maximum surface contact with the electronic component (often used with thermal interface material like grease or pads). * **Fin Pattern:** Vertical fins increase the surface area, allowing air from a cooling fan or natural convection to carry heat away more efficiently. * **Push-Pin Mechanism:** Features a brass or plastic pin with a stainless steel spring. This provides a consistent "clamping force" (pressure) to ensure the sink stays flush against the chip, which is critical for heat transfer. --- ### 3. Part Number Breakdown The nomenclature for this part provides specific details about its build: | Segment | Meaning | | :--- | :--- | | **ATS-04** | Series Identification (pushPIN™) | | **B** | Attachment Style (specific spring/pin type) | | **166** | Specific Heat Sink Geometry/Size code | | **C3** | Thermal Interface Material (usually pre-applied Phase Change Material) | | **R0** | RoHS Compliant (Lead-free) | --- ### 4. Application Use Case This part is typically found in: * **Telecommunications:** Cooling small chips on networking boards. * **Industrial PC:** Cooling processors in tight spaces. * **Embedded Systems:** Managing heat on SoCs (System on Chips) where height is limited (15mm).