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  • ATS-04B-17-C2-R0

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    The part number **ATS-04B-17-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 12.7mm | | **Attachment Type** | Push Pin (Plastic) | | **Thermal Resistance** | 15.44 °C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The nomenclature used by ATS provides specific details about the part's construction: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **04B**: Indicates the attachment style (Standard Push Pin series). * **17**: Represents the specific dimensions and footprint. * **C2**: Refers to the material and finish (Blue Anodized Aluminum). * **R0**: Indicates the revision level or packaging standard. --- ### 3. Electronic Application and Benefits This component is vital in thermal management for electronic assemblies. Its primary functions include: * **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing heat to be transferred more efficiently to the surrounding air. * **Mechanical Stability:** The push-pin mechanism uses a spring-loaded design to ensure a constant, uniform pressure against the electronic chip, which optimizes the performance of the Thermal Interface Material (TIM). * **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity, slightly improving radiation cooling. --- ### 4. Mounting Guide To use this part, the PCB must have two pre-drilled holes. The process involves: 1. Aligning the heat sink over the target component. 2. Compressing the **push pins** through the PCB holes. 3. The integrated **springs** provide the necessary tension to maintain contact.
    ✨ Follow-up Questions
    • ⤷ What is the significance of the T766 thermal interface material used in this part?
    • ⤷ How do I calculate if the 15.44 °C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there copper versions of this heat sink for higher heat loads?