ATS-04B-17-C2-R0
AI

The part number **ATS-04B-17-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 35mm x 35mm x 12.7mm |
| **Attachment Type** | Push Pin (Plastic) |
| **Thermal Resistance** | 15.44 °C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Breakdown of the Part Number
The nomenclature used by ATS provides specific details about the part's construction:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **04B**: Indicates the attachment style (Standard Push Pin series).
* **17**: Represents the specific dimensions and footprint.
* **C2**: Refers to the material and finish (Blue Anodized Aluminum).
* **R0**: Indicates the revision level or packaging standard.
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### 3. Electronic Application and Benefits
This component is vital in thermal management for electronic assemblies. Its primary functions include:
* **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing heat to be transferred more efficiently to the surrounding air.
* **Mechanical Stability:** The push-pin mechanism uses a spring-loaded design to ensure a constant, uniform pressure against the electronic chip, which optimizes the performance of the Thermal Interface Material (TIM).
* **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity, slightly improving radiation cooling.
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### 4. Mounting Guide
To use this part, the PCB must have two pre-drilled holes. The process involves:
1. Aligning the heat sink over the target component.
2. Compressing the **push pins** through the PCB holes.
3. The integrated **springs** provide the necessary tension to maintain contact.
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What is the significance of the T766 thermal interface material used in this part?
- ⤷ How do I calculate if the 15.44 °C/W thermal resistance is sufficient for my chip?
- ⤷ Are there copper versions of this heat sink for higher heat loads?