The **ATS-04B-174-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ## 1. Key Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 4.02°C/W (at 100 LFM) | | **Flow Orientation** | Vertical or Horizontal (depending on airflow) | --- ## 2. Design and Component Breakdown ### A. Fin Geometry (Straight Fin) The "174" series typically features a straight-fin design. These fins are extruded to maximize surface area while allowing air to pass through with minimal pressure drop. This is ideal for forced-air cooling environments (where a fan is present). ### B. Push-Pin Attachment Instead of using messy thermal adhesives or tapes, this unit uses a **Push-Pin** system: * **Compression Spring:** Ensures a consistent "clamping force" on the electronic chip, which optimizes heat transfer. * **Ease of Assembly:** It can be quickly installed into pre-drilled holes on a PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the heat sink usually comes pre-applied with **ATS-PPS-02** thermal grease or a similar high-performance phase-change material. This fills microscopic air gaps between the chip and the heat sink base. --- ## 3. Thermal Performance Table Thermal performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.02 | | 200 | 1.0 | 2.32 | | 300 | 1.5 | 1.84 | | 400 | 2.0 | 1.59 | | 500 | 2.5 | 1.43 | --- ## 4. Typical Applications * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators or MOSFET modules. * **Consumer Electronics:** High-end audio processors or set-top box chips.