The **ATS-04B-175-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications This part is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) chips, CPUs, or GPUs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring (STS) | | **Dimensions** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 13.52°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Key Components & Engineering Features #### A. Fin Design (XC-Cut) The heat sink features a "Cross-Cut" (XC) pattern. This means the aluminum fins are notched in both vertical and horizontal directions. * **Purpose:** Increases surface area and allows for omnidirectional airflow, making it effective even if the air is not blowing perfectly straight across the board. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or tapes, this part uses mechanical push-pins. * **Stability:** Provides consistent pressure (clamping force) on the chip, which ensures maximum heat transfer. * **Installation:** Requires pre-drilled holes in the PCB. The pins snap into place and are held under tension by the springs. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. * **Function:** This is a phase-change material that fills microscopic air gaps between the heat sink and the electronic chip. * **Advantage:** Eliminates the need for manual application of thermal grease, reducing assembly time and errors. --- ### 3. Application Use Cases This specific part is typically found in: * **Networking Equipment:** Routers, switches, and bridges. * **Industrial PCs:** Compact motherboards where space is limited (10mm low profile). * **Embedded Systems:** Microprocessors that generate moderate heat in a small footprint. ---