The **ATS-04B-189-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 2.43°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Pressure Type** | Low Pressure | | **Spring Type** | Compression Spring | --- ### 2. Electronic Application & Cooling Mechanism This part is categorized as an **active-passive thermal management** component. Its primary function is to increase the surface area of an electronic package to facilitate heat dissipation into the surrounding air. * **Thermal Interface Material (TIM):** The "R0" suffix typically denotes that the part comes pre-applied with a high-performance thermal interface material (T605), ensuring minimal thermal resistance between the chip and the heat sink. * **Fin Design:** It utilizes a **cross-cut** or straight fin design (depending on the specific sub-rev) optimized for airflow from cooling fans. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent "preload" force. This ensures constant contact pressure between the heat sink and the electronic component, which prevents air gaps caused by vibration or thermal expansion. --- ### 3. Component Breakdown (Naming Convention) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **04** | Series type (Push-pin attachment) | | **B** | Material/Design variation | | **189** | Specific dimension/form factor code | | **C2** | Thermal performance/Fin configuration | | **R0** | RoHS compliant and specific packaging/TIM configuration | --- ### 4. Integration Considerations When integrating the ATS-04B-189-C2-R0 into a PCB design, engineers must account for: 1. **Hole Pattern:** The PCB must have pre-drilled holes matching the push-pin pitch of the heat sink. 2. **Keep-out Zone:** Ensure no small capacitors or resistors are placed directly under the heat sink footprint to avoid mechanical interference. 3. **Airflow Direction:** Maximum efficiency is achieved when the fins are aligned with the system's chassis airflow.