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  • ATS-04B-210-C2-R0

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    The **ATS-04B-210-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Thermal Resistance** | 5.18°C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | | **Weight** | ~45 grams | --- ## Key Components & Design Features ### 1. The Heat Sink Body The body is constructed from high-grade aluminum. It uses a **straight fin** design which is optimized for airflow from a fan. The low profile (12.7mm height) makes it suitable for tight spaces like 1U rack servers or slim embedded devices. ### 2. pushPIN™ Attachment System Instead of using adhesive or simple clips, this model uses the proprietary ATS pushPIN™ mechanism: * **Plastic/Brass Pins:** Inserted into pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent, pre-determined pressure is applied to the component, maximizing thermal contact. ### 3. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes with a **pre-applied thermal interface material**. This is a phase-change material or thermal pad on the base of the heat sink, eliminating the need for manual application of thermal paste. ### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. While aesthetic, it also provides: * Increased corrosion resistance. * Enhanced surface emissivity (minor improvement in heat radiation). --- ## Application Scenarios * **Networking Hardware:** Cooling ASICs in switches and routers. * **Embedded Systems:** Industrial PCs where mechanical stability is required (vibration resistance). * **Power Electronics:** Dissipating heat from high-power MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on the PCB for this heat sink?
    • ⤷ How does the thermal resistance change at higher airflow rates (LFM)?
    • ⤷ Is there a version of this heat sink with a higher profile for better cooling?