The **ATS-04B-23-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" attachment series designed for cooling semiconductor components such as CPUs, GPUs, or high-power transistors. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 12.01°C/W (Unducted) to 1.31°C/W (at 200 LFM) | | **Dimensions** | 60mm x 60mm x 15mm | --- ## Key Components and Design Features ### 1. The Fin Pattern (Straight Fin) The "23" in the part number refers to the specific fin density and geometry. This model utilizes **Straight Fins**, which are optimized for high-airflow environments where air moves in a specific direction across the heat sink. ### 2. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the ATS-04B-23-C2-R0 uses a mechanical attachment: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure constant, even pressure between the heat sink and the electronic component, improving thermal transfer. ### 3. Thermal Interface Material (TIM) Most "C2" variants come pre-applied with a thermal pad or phase-change material on the base. This fills microscopic air gaps between the component and the heat sink. ### 4. Material and Coating * **Aluminum 6063:** Provides a balance between thermal conductivity and weight. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance. --- ## Performance Metrics (Thermal Resistance) Thermal resistance determines how effectively the part moves heat away from the silicon. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 12.01 | | 200 | 1.0 | 4.22 | | 300 | 1.5 | 3.25 | | 500 | 2.5 | 2.50 | --- ## Usage Precautions * **PCB Hole Pattern:** Ensure your PCB has the correct hole spacing (53mm x 53mm) to accommodate the push-pins. * **Keep-out Zones:** Check for capacitors or other tall components near the 60mm footprint that might interfere with the heat sink edges.