The **ATS-04B-38-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Push-Pin / Fin Field | | **Thermal Resistance** | 6.42° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design The unit utilizes **Straight Fins**, which are optimized for airflow in a single direction. The fins increase the surface area available for heat dissipation, allowing for better convective cooling. #### B. Attachment System (Push-Pins) The "R0" designation indicates a specific attachment kit. * **Material:** It uses brass push-pins with a stainless steel spring. * **Benefit:** This provides consistent pressure across the surface of the chip, improving the efficiency of the thermal interface material. * **Mounting:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Purpose:** To fill microscopic air gaps between the heat sink and the electronic component. * **Efficiency:** It ensures maximum heat transfer from the silicon die to the aluminum fins. --- ### 3. Application Use Cases This specific heat sink size and thermal profile are commonly used for: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Industrial PCs:** Compact motherboards where space is limited but cooling is critical. * **Embedded Systems:** Protecting sensitive chipsets from thermal throttling. ---