The **ATS-04B-55-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink from the *maxiFLOW™* series designed for cooling electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04B-55-C2-R0 | | **Heat Sink Type** | maxiFLOW™ (Cross-Cut) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 36.83mm x 36.83mm x 10.00mm | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 23.98° C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes surface area for radiant and convective cooling while minimizing pressure drop across the component. * **pushPIN™ Attachment:** This model utilizes the ATS pushPIN™ system, which includes a flexible spring-loaded mechanism. This ensures: * Consistent pressure for optimal thermal contact. * Secure attachment to the PCB through pre-drilled holes. * Easy installation and removal compared to adhesive tapes. * **Cross-Cut Fins:** The fins are cut in both vertical and horizontal directions, allowing for airflow from multiple directions, which is ideal for systems with complex or shifting airflow patterns. --- ### 3. Material and Finish * **Aluminum Construction:** Provides a balance between high thermal conductivity and low weight. * **Blue Anodized Coating:** This is not just aesthetic; the anodization increases the emissivity of the surface, slightly improving heat dissipation through radiation, and provides corrosion resistance. * **Thermal Interface Material (TIM):** The part comes with **T766** pre-applied. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the heat source (chip) and the heat sink base. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 23.98 | | 200 | 1.0 | 12.89 | | 300 | 1.5 | 9.02 | | 400 | 2.0 | 7.08 | | 500 | 2.5 | 5.88 | ---