The **ATS-04B-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Fin Style** | XC (Cross-Cut) / Straight Fin | | **Thermal Resistance** | 6.53°C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | --- ### 2. Key Component Features #### A. The Heat Sink Body * **Aluminum Construction:** Aluminum is used for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides increased surface emissivity (improving radiation cooling) and adds a layer of electrical insulation and corrosion resistance. * **XC-Cut Design:** The fins are cut to allow multi-directional airflow, making it versatile for systems where air may not flow in a perfectly straight line. #### B. The Mounting Mechanism (Push-Pin) This model uses a **push-pin and spring** assembly: 1. **Push-Pin:** Usually made of nylon or plastic, these snap into pre-drilled holes (typically 3mm) on the PCB. 2. **Spring:** A compression spring provides a consistent, calculated "clamping force." This ensures the heat sink maintains firm contact with the component (like a BGA or CPU) without cracking the silicon or the board. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with **Phase Change Material (PCM)** or a thermal pad pre-applied to the base. This fills the microscopic air gaps between the heat sink and the chip to maximize heat transfer. --- ### 3. Application Use Cases The ATS-04B-60-C2-R0 is commonly used in: * **Telecommunications:** Cooling signal processors and ASICs. * **Embedded Systems:** For industrial PCs where space is limited but vertical clearance allows for a 25mm height. * **Power Electronics:** Dissipating heat from high-speed chipsets.