The **ATS-04B-62-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Specification | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48°C/W (Unducted @ 100 LFM) | | **Airflow Pattern** | Top-to-Bottom (Straight Fin) | | **Thermal Interface Material** | T766 (Pre-applied thermal grease) | --- ### 2. Component Design Features #### A. Straight Fin Geometry The heat sink utilizes a **straight fin** design. This is ideal for systems with clear, directed airflow. The spacing between the fins is optimized to balance surface area and pressure drop. #### B. pushPIN™ Attachment Mechanism Unlike adhesive tapes or simple clips, the pushPIN™ system provides several electronic and mechanical benefits: * **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer. * **Vibration Resistance:** Securely holds the heat sink to the PCB even in high-vibration industrial environments. * **Easy Installation:** Features a flexible "push-to-lock" mechanism that reduces assembly time. #### C. Thermal Interface Material (T766) The base comes pre-applied with **T766**, a high-conductivity thermal grease. This eliminates the need for manual application and ensures there are no air gaps between the component die and the aluminum base. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.48 | | 300 (1.5 m/s) | 6.71 | | 500 (2.5 m/s) | 4.73 | | 700 (3.5 m/s) | 3.86 | --- ### 4. Application Examples This specific heat sink is typically used for: * **ASICs and FPGAs:** Mid-range processing units in networking hardware. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Embedded Systems:** Industrial PCs where height constraints (15mm) are a factor.