The **ATS-04B-68-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin style heatsink** designed by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application characteristics. ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Brass Springs) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring there is no interference with surrounding surface-mount devices (SMDs). * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Height):** 15.00 mm * **Pitch (Hole-to-Hole):** 38.00 mm --- ### 3. Thermal Performance Thermal resistance is measured in degrees Celsius per Watt (°C/W). Lower values indicate more efficient heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 15.31 | | 400 (2.0 m/s) | 9.94 | | 600 (3.0 m/s) | 7.47 | --- ### 4. Technical Characteristics * **Fin Design (Blue Anodized):** The "68" series features a cross-cut fin pattern. This design allows for omnidirectional airflow, making it ideal for systems where the direction of the cooling fan may vary or is not perfectly aligned. * **Push-Pin Mechanism:** The use of brass push-pins ensures a secure, high-pressure attachment to the PCB. This maintains constant contact between the heat source (e.g., a BGA chip) and the heatsink, preventing air gaps. * **Pre-Applied TIM:** The inclusion of T766 thermal interface material simplifies assembly in manufacturing environments, as no additional thermal paste application is required. ### 5. Common Applications This part is typically found in: * **Telecommunications:** Cooling of high-speed network processors. * **Embedded Systems:** Dissipating heat from FPGAs or ASICs. * **Power Electronics:** Managing heat for DC-DC converters or power modules. ---