The **ATS-04B-70-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. Below is a breakdown of its technical specifications and features. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-04B-70-C2-R0 | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.12°C/W (Natural Convection) | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin (Extruded) | --- ### 2. Key Electronic Features #### A. Thermal Performance The "C2" in the part number indicates a specific thermal interface material or performance category. This heat sink is designed for **High-Aspect-Ratio** cooling, meaning the fins are optimized to provide maximum surface area within a small footprint, which is critical for modern high-density PCBs. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this part uses a **Push-Pin and Spring** system: * **Secure Fit:** Provides consistent pressure on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Vibration Resistance:** The spring-loaded mechanism helps the heat sink stay in place during mechanical shock or shipping. * **Pre-drilled Holes:** Requires specific hole patterns (spaced roughly 38mm apart for this series) on the PCB. #### C. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: 1. **Increased Surface Emissivity:** Improves heat radiation. 2. **Corrosion Resistance:** Protects the aluminum from oxidation in humid environments. 3. **Electrical Insulation:** The oxide layer is non-conductive, preventing accidental shorts if the sink touches a stray wire. --- ### 3. Application Use Cases This specific model is typically found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Heat dissipation for MOSFETs or bridge rectifiers. * **Embedded Systems:** Industrial PCs where airflow might be restricted. --- ### 4. Thermal Resistance Profile The efficiency of this heat sink changes based on the airflow (LFM - Linear Feet per Minute): ```text Airflow (LFM) | Thermal Resistance (°C/W) ------------------------------------------ 100 | 8.70 200 | 4.60 300 | 3.40 400 | 2.80 500 | 2.50 ``` ---