The **ATS-04B-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "push-pin" attachment series. --- ### 1. Key Specifications The following table summarizes the physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 5.19°C/W (at 200 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Application & Function Electronic parts like the ATS-04B-72-C3-R0 are critical for maintaining the longevity of semiconductors. * **Heat Dissipation:** It increases the surface area of a component (like a CPU, GPU, or FPGA), allowing heat to transfer more efficiently into the surrounding air. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or a similar interface pre-applied to the base to ensure there are no air gaps between the chip and the heat sink. * **Airflow Compatibility:** The straight-fin design is optimized for systems with consistent directional airflow (forced convection). --- ### 3. Mechanical Components The part number can be broken down into its mechanical assembly features: 1. **The Heat Sink:** A square aluminum block with vertical fins. 2. **Push-Pins:** Two brass pins that snap into pre-drilled holes on the Printed Circuit Board (PCB). This provides a more secure mechanical connection than simple adhesive. 3. **Springs:** Located on the push-pins to provide consistent downward pressure, ensuring the heat sink stays flush against the electronic component during vibrations or thermal expansion. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): * **@ 200 LFM:** 5.19 °C/W * **@ 400 LFM:** 3.48 °C/W * **@ 600 LFM:** 2.85 °C/W *Note: A lower °C/W rating indicates more efficient cooling.*