Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-04B-76-C3-R0

  • AI
    The **ATS-04B-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04B-76-C3-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 11.84°C/W (at 100 LFM) | | **Fin Style** | maxiFLOW (Tapered Fin) | --- ### 2. Design and Engineering Features #### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design utilizes a unique tapered fin structure. This geometry is engineered to: * **Increase Surface Area:** Maximizes the area available for heat dissipation within a small footprint. * **Reduce Pressure Drop:** Allows air to flow through the fins more easily compared to standard straight-fin designs. #### B. pushPIN™ Attachment The "B" in the part number often denotes the specific attachment mechanism. The **pushPIN™** system ensures: * **Secure Mounting:** Uses a spring-loaded mechanism to maintain constant pressure on the semiconductor. * **Reliability:** Provides high vibration resistance, making it suitable for industrial and telecommunications hardware. #### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized:** The surface treatment improves emissivity (radiant heat transfer) and provides corrosion resistance. --- ### 3. Applications This specific heat sink size (25mm x 25mm) is commonly used for: * **ASICs and FPGAs:** Cooling localized high-heat processors on PCBs. * **Network Switches:** Used in compact networking gear where airflow is directional. * **Power Supplies:** Cooling voltage regulators or power transistors. --- ### 4. Part Number Breakdown The nomenclature can be interpreted as follows: * **ATS:** Advanced Thermal Solutions. * **04:** Denotes the product series or family. * **B:** Attachment style (pushPIN™). * **76:** Specific size/geometry code. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the exact thermal resistance values at different airflow speeds (LFM)?
    • ⤷ How does the pushPIN™ attachment compare to thermal adhesive tape?
    • ⤷ Can this heat sink be used with a specific TIM (Thermal Interface Material)?