ATS-04B-76-C3-R0
AI

The **ATS-04B-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow.
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### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-04B-76-C3-R0 |
| **Material** | Aluminum (Anodized Blue) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 25mm x 25mm x 15mm |
| **Thermal Resistance** | 11.84°C/W (at 100 LFM) |
| **Fin Style** | maxiFLOW (Tapered Fin) |
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### 2. Design and Engineering Features
#### A. Fin Geometry (maxiFLOW™)
The "maxiFLOW" design utilizes a unique tapered fin structure. This geometry is engineered to:
* **Increase Surface Area:** Maximizes the area available for heat dissipation within a small footprint.
* **Reduce Pressure Drop:** Allows air to flow through the fins more easily compared to standard straight-fin designs.
#### B. pushPIN™ Attachment
The "B" in the part number often denotes the specific attachment mechanism. The **pushPIN™** system ensures:
* **Secure Mounting:** Uses a spring-loaded mechanism to maintain constant pressure on the semiconductor.
* **Reliability:** Provides high vibration resistance, making it suitable for industrial and telecommunications hardware.
#### C. Material and Finish
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized:** The surface treatment improves emissivity (radiant heat transfer) and provides corrosion resistance.
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### 3. Applications
This specific heat sink size (25mm x 25mm) is commonly used for:
* **ASICs and FPGAs:** Cooling localized high-heat processors on PCBs.
* **Network Switches:** Used in compact networking gear where airflow is directional.
* **Power Supplies:** Cooling voltage regulators or power transistors.
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### 4. Part Number Breakdown
The nomenclature can be interpreted as follows:
* **ATS:** Advanced Thermal Solutions.
* **04:** Denotes the product series or family.
* **B:** Attachment style (pushPIN™).
* **76:** Specific size/geometry code.
* **C3:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
- ⤷
What are the exact thermal resistance values at different airflow speeds (LFM)?
- ⤷ How does the pushPIN™ attachment compare to thermal adhesive tape?
- ⤷ Can this heat sink be used with a specific TIM (Thermal Interface Material)?